國際簡稱:IEEE T RELIAB 參考譯名:可靠性交易
主要研究方向:工程技術-工程:電子與電氣 非預警期刊 審稿周期: 約4.5個月
《可靠性交易》(Ieee Transactions On Reliability)是一本由Institute of Electrical and Electronics Engineers Inc.出版的以工程技術-工程:電子與電氣為研究特色的國際期刊,發(fā)表該領域相關的原創(chuàng)研究文章、評論文章和綜述文章,及時報道該領域相關理論、實踐和應用學科的最新發(fā)現,旨在促進該學科領域科學信息的快速交流。該期刊是一本未開放期刊,近三年沒有被列入預警名單。該期刊享有很高的科學聲譽,影響因子不斷增加,發(fā)行量也同樣高。
IEEE Transactions on Reliability is a refereed journal for the reliability and allied disciplines including, but not limited to, maintainability, physics of failure, life testing, prognostics, design and manufacture for reliability, reliability for systems of systems, network availability, mission success, warranty, safety, and various measures of effectiveness. Topics eligible for publication range from hardware to software, from materials to systems, from consumer and industrial devices to manufacturing plants, from individual items to networks, from techniques for making things better to ways of predicting and measuring behavior in the field. As an engineering subject that supports new and existing technologies, we constantly expand into new areas of the assurance sciences.
CiteScore | SJR | SNIP | CiteScore 指數 | ||||||||||||
12.2 | 1.511 | 1.989 |
|
名詞解釋:CiteScore 是衡量期刊所發(fā)表文獻的平均受引用次數,是在 Scopus 中衡量期刊影響力的另一個指標。當年CiteScore 的計算依據是期刊最近4年(含計算年度)的被引次數除以該期刊近四年發(fā)表的文獻數。例如,2022年的 CiteScore 計算方法為:2022年的 CiteScore =2019-2022年收到的對2019-2022年發(fā)表的文件的引用數量÷2019-2022年發(fā)布的文獻數量 注:文獻類型包括:文章、評論、會議論文、書籍章節(jié)和數據論文。
Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
否 | 否 | 計算機科學 | 2區(qū) | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計算機:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 計算機:軟件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 2區(qū) 2區(qū) 2區(qū) |
Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
否 | 否 | 計算機科學 | 2區(qū) | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計算機:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 計算機:軟件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 2區(qū) 2區(qū) 2區(qū) |
Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
是 | 否 | 計算機科學 | 2區(qū) | COMPUTER SCIENCE, SOFTWARE ENGINEERING 計算機:軟件工程 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計算機:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 1區(qū) 2區(qū) 2區(qū) |
Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
否 | 否 | 工程技術 | 3區(qū) | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計算機:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 計算機:軟件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 3區(qū) 2區(qū) 3區(qū) |
Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
是 | 否 | 計算機科學 | 2區(qū) | COMPUTER SCIENCE, SOFTWARE ENGINEERING 計算機:軟件工程 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計算機:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 1區(qū) 2區(qū) 2區(qū) |
Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
否 | 否 | 計算機科學 | 2區(qū) | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計算機:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 計算機:軟件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 2區(qū) 2區(qū) 2區(qū) |
按JIF指標學科分區(qū) | 收錄子集 | 分區(qū) | 排名 | 百分位 |
學科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q1 | 8 / 59 |
87.3% |
學科:COMPUTER SCIENCE, SOFTWARE ENGINEERING | SCIE | Q1 | 13 / 131 |
90.5% |
學科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q1 | 65 / 352 |
81.7% |
按JCI指標學科分區(qū) | 收錄子集 | 分區(qū) | 排名 | 百分位 |
學科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q1 | 7 / 59 |
88.98% |
學科:COMPUTER SCIENCE, SOFTWARE ENGINEERING | SCIE | Q1 | 14 / 131 |
89.69% |
學科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q1 | 42 / 354 |
88.28% |
Author: He, Yan-Lin; Li, Kun; Liang, Li-Long; Xu, Yuan; Zhu, Qun-Xiong
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 166-176. DOI: 10.1109/TR.2021.3115108
Author: Huang, Yanze; Lin, Limei; Lin, Yuhang; Xu, Li; Hsieh, Sun-Yuan
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 372-383. DOI: 10.1109/TR.2021.3129257
Author: Zhang, Ning; Xu, Yuan; Zhu, Qun-Xiong; He, Yan-Lin
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 204-213. DOI: 10.1109/TR.2021.3139539
Author: Wang, Kai; Xu, Zhaoping; Liu, Yu; Fang, Yiping
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 190-203. DOI: 10.1109/TR.2021.3132774
Author: Li, Zheng; Wu, Yonghao; Peng, Bin; Chen, Xiang; Sun, Zeyu; Liu, Yong; Paul, Doyle
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 258-273. DOI: 10.1109/TR.2022.3154773
Author: Kou, Gang; Yi, Kunxiang; Xiao, Hui; Peng, Rui
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 3-14. DOI: 10.1109/TR.2022.3161638
Author: Gong, Hongfang; Li, Renfa; An, Jiyao; Xie, Guoqi
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 224-239. DOI: 10.1109/TR.2022.3160460
Author: Gong, Siqian; Zhu, Xiaomin; Zhang, Runtong; Zhao, Hongmei; Guo, Chao
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 329-342. DOI: 10.1109/TR.2022.3161359
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