Journal Of Materials Science-materials In Electronics SCIE

國際簡稱：J MATER SCI-MATER EL 參考譯名：材料科學雜志-電子材料

主要研究方向：工程技術(shù)-材料科學：綜合非預警期刊審稿周期：約33 days, Submission to first decision; 92 days, Submission to acceptance 約1.5個月

《材料科學雜志-電子材料》(Journal Of Materials Science-materials In Electronics)是一本由Springer US出版的以工程技術(shù)-材料科學：綜合為研究特色的國際期刊，發(fā)表該領域相關(guān)的原創(chuàng)研究文章、評論文章和綜述文章，及時報道該領域相關(guān)理論、實踐和應用學科的最新發(fā)現(xiàn)，旨在促進該學科領域科學信息的快速交流。該期刊是一本未開放期刊，近三年沒有被列入預警名單。

4區(qū) 中科院分區(qū)
Q2 JCR分區(qū)
2249 年發(fā)文量
2.8 IF影響因子
未開放 是否OA
63 H-index
1990 創(chuàng)刊年份
Monthly 出版周期
English 出版語言

The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.

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Journal Of Materials Science-materials In Electronics期刊信息

ISSN：0957-4522
出版語言：English
是否OA：未開放
E-ISSN：1573-482X
出版地區(qū)：NETHERLANDS
是否預警：否
出版商：Springer US
出版周期：Monthly
創(chuàng)刊時間：1990
開源占比：0.0135
Gold OA文章占比：2.18%
OA被引用占比：0.0108...
出版國人文章占比：0.36
出版撤稿占比：0
研究類文章占比：99.47%

Journal Of Materials Science-materials In Electronics CiteScore評價數(shù)據(jù)（2024年最新版）

CiteScore

SJR

SNIP

CiteScore 指數(shù)

0.512

0.696

學科類別	分區(qū)	排名	百分位
大類：Physics and Astronomy 小類：Condensed Matter Physics	Q2	140 / 434	67%
大類：Physics and Astronomy 小類：Electrical and Electronic Engineering	Q2	262 / 797	67%
大類：Physics and Astronomy 小類：Electronic, Optical and Magnetic Materials	Q2	96 / 284	66%
大類：Physics and Astronomy 小類：Atomic and Molecular Physics, and Optics	Q2	76 / 224	66%

名詞解釋：CiteScore 是衡量期刊所發(fā)表文獻的平均受引用次數(shù)，是在 Scopus 中衡量期刊影響力的另一個指標。當年CiteScore 的計算依據(jù)是期刊最近4年（含計算年度）的被引次數(shù)除以該期刊近四年發(fā)表的文獻數(shù)。例如，2022年的 CiteScore 計算方法為：2022年的 CiteScore =2019-2022年收到的對2019-2022年發(fā)表的文件的引用數(shù)量÷2019-2022年發(fā)布的文獻數(shù)量注：文獻類型包括：文章、評論、會議論文、書籍章節(jié)和數(shù)據(jù)論文。

Journal Of Materials Science-materials In Electronics中科院評價數(shù)據(jù)

中科院 2023年12月升級版

Top期刊	綜述期刊	大類學科		小類學科
否	否	工程技術(shù)	4區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學：綜合 PHYSICS, APPLIED 物理：應用 PHYSICS, CONDENSED MATTER 物理：凝聚態(tài)物理	4區(qū) 4區(qū) 4區(qū) 4區(qū)

中科院 2022年12月升級版

Top期刊	綜述期刊	大類學科		小類學科
否	否	工程技術(shù)	4區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學：綜合 PHYSICS, APPLIED 物理：應用 PHYSICS, CONDENSED MATTER 物理：凝聚態(tài)物理	4區(qū) 4區(qū) 4區(qū) 4區(qū)

中科院 2021年12月舊的升級版

Top期刊	綜述期刊	大類學科		小類學科
否	否	工程技術(shù)	4區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學：綜合 PHYSICS, APPLIED 物理：應用 PHYSICS, CONDENSED MATTER 物理：凝聚態(tài)物理	4區(qū) 4區(qū) 4區(qū) 4區(qū)

中科院 2021年12月基礎版

Top期刊	綜述期刊	大類學科		小類學科
否	否	工程技術(shù)	4區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學：綜合 PHYSICS, APPLIED 物理：應用 PHYSICS, CONDENSED MATTER 物理：凝聚態(tài)物理	4區(qū) 4區(qū) 4區(qū) 4區(qū)

中科院 2021年12月升級版

Top期刊	綜述期刊	大類學科		小類學科
否	否	工程技術(shù)	4區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學：綜合 PHYSICS, APPLIED 物理：應用 PHYSICS, CONDENSED MATTER 物理：凝聚態(tài)物理	4區(qū) 4區(qū) 4區(qū) 4區(qū)

中科院 2020年12月舊的升級版

Top期刊	綜述期刊	大類學科		小類學科
否	否	工程技術(shù)	4區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學：綜合 PHYSICS, APPLIED 物理：應用 PHYSICS, CONDENSED MATTER 物理：凝聚態(tài)物理	4區(qū) 4區(qū) 4區(qū) 4區(qū)

Journal Of Materials Science-materials In Electronics JCR評價數(shù)據(jù)（2023-2024年最新版）

按JIF指標學科分區(qū)	收錄子集	分區(qū)	排名	百分位
學科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q2	151 / 352	57.2%
學科：MATERIALS SCIENCE, MULTIDISCIPLINARY	SCIE	Q3	229 / 438	47.8%
學科：PHYSICS, APPLIED	SCIE	Q2	74 / 179	58.9%
學科：PHYSICS, CONDENSED MATTER	SCIE	Q2	37 / 79	53.8%

按JCI指標學科分區(qū)	收錄子集	分區(qū)	排名	百分位
學科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q2	168 / 354	52.68%
學科：MATERIALS SCIENCE, MULTIDISCIPLINARY	SCIE	Q2	217 / 438	50.57%
學科：PHYSICS, APPLIED	SCIE	Q2	83 / 179	53.91%
學科：PHYSICS, CONDENSED MATTER	SCIE	Q2	29 / 79	63.92%

Journal Of Materials Science-materials In Electronics歷年數(shù)據(jù)統(tǒng)計

影響因子

中科院分區(qū)

Journal Of Materials Science-materials In Electronics中國學者發(fā)文選摘

1、A facile fabrication of nanocomposites with dual conductive networks based on 3D nickel foam, 1D silver nanowires and 2D boron nitride nanosheets
Author: Zhu, Shuangbao; Li, Weizhen; Yuan, Weichao; Meng, Yiming; Chu, Zhongyang; Gan, Wenjun

Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09582-y
2、Controllable preparation of CaCu3Ti4O12 nanowires and its strengthening effect on high dielectric polymer composites
Author: Zhu, Min; Li, Guan; Xu, Haiping; Xie, Huaqing; Liao, Yangke

Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09417-w
3、Low-hysteresis perovskite solar cells based on a spray-coated electron transport layer
Author: Zheng, Xiaohong; Su, Jian; Liu, Shanyi; Guo, Huafei; Gu, Ding; Jiang, Sai; Qiu, Jianhua

Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09690-9
4、Relaxation behavior and energy storage of A-site substituted Sr4-xNa2-xLaxTa0.6Nb9.4O30 ferroelectric ceramics
Author: Zheng, Xiao; Jin, Zuheng; Dan, Yuejun; Hu, Changzheng; Liu, Laijun; Fang, Liang

Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 2, pp. -. DOI: 10.1007/s10854-022-09492-z
5、Frictional metallurgy induced formation and evolution of solder/Cu column interconnect microstructure and properties
Author: Zhao, Zhili; Xiao, Kai; Quan, Wenlei; Hu, Mingdeng; Li, Jiazhe

Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 3, pp. -. DOI: 10.1007/s10854-022-09675-8
6、Highly conductive films sintered by Au-Ag nanoparticles ink at low temperature
Author: Zhang, Zhen; Li, Jinglong; Liu, Tao; Tian, Wenhuai; Li, Zhipeng

Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 2, pp. -. DOI: 10.1007/s10854-022-09649-w
7、Construction of foot-movement monitoring sensor based on triboelectric signals via embroidery technique with PDMS coated conductive cotton yarn
Author: Zhang, Shichen

Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 1, pp. -. DOI: 10.1007/s10854-022-09464-3
8、Efficient MXene/CNT electromagnetic shielding composite films with self-assembly multilayer structure
Author: Zhang, Pengcheng; Ru, Xuanhe; Li, Haiyang; Liang, Haoyu; Wang, Huanping; Yang, Chenhui; Zhang, Xiaoguang; Liu, Zhenguo; Zhang, Qiuyu; Chen, Yanhui

Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2023; Vol. 34, Issue 1, pp. -. DOI: 10.1007/s10854-022-09498-7