Materials Science In Semiconductor Processing SCIE

國際簡稱：MAT SCI SEMICON PROC 參考譯名：半導體加工中的材料科學

主要研究方向：工程技術-材料科學：綜合非預警期刊審稿周期：約1.7個月約3.7周

《半導體加工中的材料科學》(Materials Science In Semiconductor Processing)是一本由Elsevier Ltd出版的以工程技術-材料科學：綜合為研究特色的國際期刊，發(fā)表該領域相關的原創(chuàng)研究文章、評論文章和綜述文章，及時報道該領域相關理論、實踐和應用學科的最新發(fā)現(xiàn)，旨在促進該學科領域科學信息的快速交流。該期刊是一本未開放期刊，近三年沒有被列入預警名單。

3區(qū) 中科院分區(qū)
Q2 JCR分區(qū)
635 年發(fā)文量
4.2 IF影響因子
未開放 是否OA
49 H-index
1998 創(chuàng)刊年份
Bimonthly 出版周期
English 出版語言

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.

Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.

Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.

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Materials Science In Semiconductor Processing期刊信息

ISSN：1369-8001
出版語言：English
是否OA：未開放
E-ISSN：1873-4081
出版地區(qū)：ENGLAND
是否預警：否
出版商：Elsevier Ltd
出版周期：Bimonthly
創(chuàng)刊時間：1998
開源占比：0.0145
Gold OA文章占比：5.21%
OA被引用占比：0.0123...
出版國人文章占比：0.21
出版撤稿占比：0
研究類文章占比：96.22%

Materials Science In Semiconductor Processing CiteScore評價數(shù)據(jù)（2024年最新版）

CiteScore

SJR

SNIP

CiteScore 指數(shù)

0.732

0.992

學科類別	分區(qū)	排名	百分位
大類：Engineering 小類：Mechanical Engineering	Q1	87 / 672	87%
大類：Engineering 小類：Condensed Matter Physics	Q1	59 / 434	86%
大類：Engineering 小類：Mechanics of Materials	Q1	60 / 398	85%
大類：Engineering 小類：General Materials Science	Q1	100 / 463	78%

名詞解釋：CiteScore 是衡量期刊所發(fā)表文獻的平均受引用次數(shù)，是在 Scopus 中衡量期刊影響力的另一個指標。當年CiteScore 的計算依據(jù)是期刊最近4年（含計算年度）的被引次數(shù)除以該期刊近四年發(fā)表的文獻數(shù)。例如，2022年的 CiteScore 計算方法為：2022年的 CiteScore =2019-2022年收到的對2019-2022年發(fā)表的文件的引用數(shù)量÷2019-2022年發(fā)布的文獻數(shù)量注：文獻類型包括：文章、評論、會議論文、書籍章節(jié)和數(shù)據(jù)論文。

Materials Science In Semiconductor Processing中科院評價數(shù)據(jù)

中科院 2023年12月升級版

Top期刊	綜述期刊	大類學科		小類學科
否	否	工程技術	3區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學：綜合 PHYSICS, APPLIED 物理：應用 PHYSICS, CONDENSED MATTER 物理：凝聚態(tài)物理	3區(qū) 3區(qū) 3區(qū) 3區(qū)

中科院 2022年12月升級版

Top期刊	綜述期刊	大類學科		小類學科
否	否	工程技術	3區(qū)	PHYSICS, APPLIED 物理：應用 PHYSICS, CONDENSED MATTER 物理：凝聚態(tài)物理 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學：綜合	2區(qū) 2區(qū) 3區(qū) 3區(qū)

中科院 2021年12月舊的升級版

Top期刊	綜述期刊	大類學科		小類學科
否	否	工程技術	3區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學：綜合 PHYSICS, APPLIED 物理：應用 PHYSICS, CONDENSED MATTER 物理：凝聚態(tài)物理	3區(qū) 3區(qū) 3區(qū) 3區(qū)

中科院 2021年12月基礎版

Top期刊	綜述期刊	大類學科		小類學科
否	否	工程技術	3區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學：綜合 PHYSICS, APPLIED 物理：應用 PHYSICS, CONDENSED MATTER 物理：凝聚態(tài)物理	3區(qū) 4區(qū) 3區(qū) 3區(qū)

中科院 2021年12月升級版

Top期刊	綜述期刊	大類學科		小類學科
否	否	工程技術	3區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學：綜合 PHYSICS, APPLIED 物理：應用 PHYSICS, CONDENSED MATTER 物理：凝聚態(tài)物理	3區(qū) 3區(qū) 3區(qū) 3區(qū)

中科院 2020年12月舊的升級版

Top期刊	綜述期刊	大類學科		小類學科
否	否	工程技術	3區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學：綜合 PHYSICS, APPLIED 物理：應用 PHYSICS, CONDENSED MATTER 物理：凝聚態(tài)物理	3區(qū) 3區(qū) 3區(qū) 3區(qū)

Materials Science In Semiconductor Processing JCR評價數(shù)據(jù)（2023-2024年最新版）

按JIF指標學科分區(qū)	收錄子集	分區(qū)	排名	百分位
學科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q2	89 / 352	74.9%
學科：MATERIALS SCIENCE, MULTIDISCIPLINARY	SCIE	Q2	158 / 438	64%
學科：PHYSICS, APPLIED	SCIE	Q2	51 / 179	71.8%
學科：PHYSICS, CONDENSED MATTER	SCIE	Q2	25 / 79	69%

按JCI指標學科分區(qū)	收錄子集	分區(qū)	排名	百分位
學科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q2	113 / 354	68.22%
學科：MATERIALS SCIENCE, MULTIDISCIPLINARY	SCIE	Q2	125 / 438	71.58%
學科：PHYSICS, APPLIED	SCIE	Q2	47 / 179	74.02%
學科：PHYSICS, CONDENSED MATTER	SCIE	Q1	19 / 79	76.58%

Materials Science In Semiconductor Processing歷年數(shù)據(jù)統(tǒng)計

影響因子

中科院分區(qū)

Materials Science In Semiconductor Processing中國學者發(fā)文選摘

1、V2O5 nanobelts via a facile water-assisted strategy boosting electrochromic performance
Author: Sun, Haohao; Wang, Wenxuan; Fan, Qiongzhen; Qi, Yanyuan; Xiong, Yuli; Jian, Zelang; Chen, Wen

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 155, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107265
2、Ag/Ag3PO4 nanoparticles assembled on sepiolite nanofibers: Enhanced visible-light-driven photocatalysis and the important role of Ag decoration
Author: Ren, Xiaofei; Hu, Guicong; Guo, Qingbin; Gao, Dengzheng; Wang, Li; Hu, Xiaolong

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107272
3、Exploring the effect of oxygen environment on the Mo/CdTe/CdSe solar cell substrate configuration
Author: Yang, Xiutao; Long, Yuchen; Zheng, Yujie; Wang, Jiayi; Zhou, Biao; Xie, Shenghui; Li, Bing; Zhang, Jingquan; Hao, Xia; Karazhanov, Smagul; Zeng, Guanggen; Feng, Lianghuan

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107267
4、Slag refining at various viscosity conditions for SiC inclusion removal during Si scraps recycling
Author: Pan, Di; Jiang, Dachuan; Hu, Zhiqiang; Li, Pengting; Tan, Yi; Li, Jin; Li, Jiayan

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107274
5、Fabrication of interface-engineered Ni/NiO/rGO nanobush for highly efficient and durable oxygen reduction
Author: Wang, Yanan; Duan, Chunyang; Li, Junhua; Zhao, Zenghua; Xu, Jiasheng; Liu, Lin; Qian, Jianhua

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107259
6、The structural, mechanical and electronic properties of BaxNy compounds
Author: Wang, Gao-Min; Zeng, Wei; Zhang, Fan; Li, Xing-Han; Liu, Fu-Sheng; Tang, Bin; Zhong, Mi; Liu, Qi-Jun

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107268
7、Synergistic effect of 1,2,4-triazole and phytic acid as inhibitors on copper film CMP for ruthenium- based copper interconnected and the surface action mechanism analysis
Author: Luo, Fu; Niu, Xinhuan; Yan, Han; Zhang, Yinchan; Qu, Minghui; Zhu, Yebo; Hou, Ziyang

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107276
8、Hyperspectral camouflage coating using Palygorskite to simulate water absorption of healthy green leaves
Author: Lu, Haipeng; Bai, Xingzhi; Wang, Zhenxiong; Guo, Yang; Zhang, Li; Weng, Xiaolong; Xie, Jianliang; Liang, Difei; Deng, Longjiang

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107293