國際簡稱:DIGIT SIGNAL PROCESS 參考譯名:數(shù)字信號處理
主要研究方向:工程技術-工程:電子與電氣 非預警期刊 審稿周期:約Review time: 108 days; Submission to acceptance: 147 days; Acceptance to publication: 8 days; 約14.0個月
《數(shù)字信號處理》(Digital Signal Processing)是一本由Elsevier Inc.出版的以工程技術-工程:電子與電氣為研究特色的國際期刊,發(fā)表該領域相關的原創(chuàng)研究文章、評論文章和綜述文章,及時報道該領域相關理論、實踐和應用學科的最新發(fā)現(xiàn),旨在促進該學科領域科學信息的快速交流。該期刊是一本未開放期刊,近三年沒有被列入預警名單。
Digital Signal Processing: A Review Journal is one of the oldest and most established journals in the field of signal processing yet it aims to be the most innovative. The Journal invites top quality research articles at the frontiers of research in all aspects of signal processing. Our objective is to provide a platform for the publication of ground-breaking research in signal processing with both academic and industrial appeal.
The journal has a special emphasis on statistical signal processing methodology such as Bayesian signal processing, and encourages articles on emerging applications of signal processing such as:
? big data? machine learning? internet of things? information security? systems biology and computational biology,? financial time series analysis,? autonomous vehicles,? quantum computing,? neuromorphic engineering,? human-computer interaction and intelligent user interfaces,? environmental signal processing,? geophysical signal processing including seismic signal processing,? chemioinformatics and bioinformatics,? audio, visual and performance arts,? disaster management and prevention,? renewable energy,
CiteScore | SJR | SNIP | CiteScore 指數(shù) | ||||||||||||||||||||||||||||||||
5.3 | 0.799 | 1.133 |
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名詞解釋:CiteScore 是衡量期刊所發(fā)表文獻的平均受引用次數(shù),是在 Scopus 中衡量期刊影響力的另一個指標。當年CiteScore 的計算依據(jù)是期刊最近4年(含計算年度)的被引次數(shù)除以該期刊近四年發(fā)表的文獻數(shù)。例如,2022年的 CiteScore 計算方法為:2022年的 CiteScore =2019-2022年收到的對2019-2022年發(fā)表的文件的引用數(shù)量÷2019-2022年發(fā)布的文獻數(shù)量 注:文獻類型包括:文章、評論、會議論文、書籍章節(jié)和數(shù)據(jù)論文。
Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
否 | 否 | 工程技術 | 3區(qū) | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 3區(qū) |
Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
否 | 否 | 工程技術 | 3區(qū) | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 3區(qū) |
Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
否 | 否 | 工程技術 | 2區(qū) | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 3區(qū) |
Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
否 | 否 | 工程技術 | 3區(qū) | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 3區(qū) |
Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
否 | 否 | 工程技術 | 2區(qū) | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 3區(qū) |
Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
否 | 否 | 工程技術 | 2區(qū) | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 3區(qū) |
按JIF指標學科分區(qū) | 收錄子集 | 分區(qū) | 排名 | 百分位 |
學科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q2 | 143 / 352 |
59.5% |
按JCI指標學科分區(qū) | 收錄子集 | 分區(qū) | 排名 | 百分位 |
學科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q2 | 140 / 354 |
60.59% |
Author: Xiao, Huachao; Wang, Yangxin; Liu, Jianyi; Huo, Jiaxin; Hu, Yang; Wang, Yu
Journal: DIGITAL SIGNAL PROCESSING. 2023; Vol. 133, Issue , pp. -. DOI: 10.1016/j.dsp.2022.103864
Author: Cheng, Yabing; Zhang, Rui; Chen, Shuming
Journal: DIGITAL SIGNAL PROCESSING. 2023; Vol. 133, Issue , pp. -. DOI: 10.1016/j.dsp.2022.103860
Author: Tang, Wanwei; Wang, Lixia; Wang, Zedai; Han, Guofeng; Zhao, Jinlong; Yue, Xinwei
Journal: DIGITAL SIGNAL PROCESSING. 2023; Vol. 133, Issue , pp. -. DOI: 10.1016/j.dsp.2022.103877
Author: Gao, Guangyong; Zhang, Liping; Lin, Yuan; Tong, Shikun; Yuan, Chengsheng
Journal: DIGITAL SIGNAL PROCESSING. 2023; Vol. 133, Issue , pp. -. DOI: 10.1016/j.dsp.2022.103870
Author: Du, Mingyang; Zhong, Ping; Cai, Xiaohao; Bi, Daping; Jing, Aiqi
Journal: DIGITAL SIGNAL PROCESSING. 2023; Vol. 133, Issue , pp. -. DOI: 10.1016/j.dsp.2022.103874
Author: Yang, Chao; Wang, Yue; Wang, Yansong; Guo, Hui; Hu, Dingyu
Journal: DIGITAL SIGNAL PROCESSING. 2023; Vol. 133, Issue , pp. -. DOI: 10.1016/j.dsp.2022.103872
Author: Ding, Zhaisheng; Li, Haiyan; Zhou, Dongming; Liu, Yanyu; Hou, Ruichao
Journal: DIGITAL SIGNAL PROCESSING. 2023; Vol. 133, Issue , pp. -. DOI: 10.1016/j.dsp.2022.103875
Author: Zhao, Yu; Shu, Qiaoyuan
Journal: DIGITAL SIGNAL PROCESSING. 2023; Vol. 133, Issue , pp. -. DOI: 10.1016/j.dsp.2022.103885
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