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中科院 1區(qū) 期刊 JCR Q1 期刊中科院 2區(qū) 期刊 JCR Q2 期刊中科院 3區(qū) 期刊 JCR Q3 期刊中科院 4區(qū) 期刊 JCR Q4 期刊

Journal Of Micromechanics And Microengineering SCIE

國(guó)際簡(jiǎn)稱：J MICROMECH MICROENG 參考譯名：微機(jī)械與微工程雜志

主要研究方向：工程技術(shù)-材料科學(xué)：綜合非預(yù)警期刊審稿周期：約2.8個(gè)月

《微機(jī)械與微工程雜志》(Journal Of Micromechanics And Microengineering)是一本由IOP Publishing Ltd.出版的以工程技術(shù)-材料科學(xué)：綜合為研究特色的國(guó)際期刊，發(fā)表該領(lǐng)域相關(guān)的原創(chuàng)研究文章、評(píng)論文章和綜述文章，及時(shí)報(bào)道該領(lǐng)域相關(guān)理論、實(shí)踐和應(yīng)用學(xué)科的最新發(fā)現(xiàn)，旨在促進(jìn)該學(xué)科領(lǐng)域科學(xué)信息的快速交流。該期刊是一本未開放期刊，近三年沒有被列入預(yù)警名單。

4區(qū) 中科院分區(qū)
Q2 JCR分區(qū)
137 年發(fā)文量
2.4 IF影響因子
未開放 是否OA
119 H-index
1991 創(chuàng)刊年份
Monthly 出版周期
English 出版語(yǔ)言

Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.

The journal is focussed on all aspects of:

-nano- and micro- mechanical systems

-nano- and micro- electomechanical systems

-nano- and micro- electrical and mechatronic systems

-nano- and micro- engineering

-nano- and micro- scale science

Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.

Below are some examples of the topics that are included within the scope of the journal:

-MEMS and NEMS:

Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.

-Fabrication techniques and manufacturing:

Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.

-Packaging and Integration technologies.

-Materials, testing, and reliability.

-Micro- and nano-fluidics:

Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.

-Lab-on-a-chip and micro- and nano-total analysis systems.

-Biomedical systems and devices:

Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.

-Energy and power:

Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.

-Electronics:

Including flexible electronics, wearable electronics, interface electronics.

-Optical systems.

-Robotics.

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Journal Of Micromechanics And Microengineering期刊信息

ISSN：0960-1317
出版語(yǔ)言：English
是否OA：未開放
E-ISSN：1361-6439
出版地區(qū)：ENGLAND
是否預(yù)警：否
出版商：IOP Publishing Ltd.
出版周期：Monthly
創(chuàng)刊時(shí)間：1991
開源占比：0.0884
Gold OA文章占比：13.91%
OA被引用占比：0.0241...
出版國(guó)人文章占比：0.31
出版撤稿占比：0
研究類文章占比：95.62%

Journal Of Micromechanics And Microengineering CiteScore評(píng)價(jià)數(shù)據(jù)（2024年最新版）

CiteScore

SJR

SNIP

CiteScore 指數(shù)

4.5

0.476

0.789

學(xué)科類別	分區(qū)	排名	百分位
大類：Engineering 小類：Mechanical Engineering	Q2	207 / 672	69%
大類：Engineering 小類：Mechanics of Materials	Q2	146 / 398	63%
大類：Engineering 小類：Electrical and Electronic Engineering	Q2	292 / 797	63%
大類：Engineering 小類：Electronic, Optical and Magnetic Materials	Q2	118 / 284	58%

名詞解釋：CiteScore 是衡量期刊所發(fā)表文獻(xiàn)的平均受引用次數(shù)，是在 Scopus 中衡量期刊影響力的另一個(gè)指標(biāo)。當(dāng)年CiteScore 的計(jì)算依據(jù)是期刊最近4年（含計(jì)算年度）的被引次數(shù)除以該期刊近四年發(fā)表的文獻(xiàn)數(shù)。例如，2022年的 CiteScore 計(jì)算方法為：2022年的 CiteScore =2019-2022年收到的對(duì)2019-2022年發(fā)表的文件的引用數(shù)量÷2019-2022年發(fā)布的文獻(xiàn)數(shù)量注：文獻(xiàn)類型包括：文章、評(píng)論、會(huì)議論文、書籍章節(jié)和數(shù)據(jù)論文。

Journal Of Micromechanics And Microengineering中科院評(píng)價(jià)數(shù)據(jù)

中科院 2023年12月升級(jí)版

Top期刊	綜述期刊	大類學(xué)科		小類學(xué)科
否	否	工程技術(shù)	4區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 INSTRUMENTS & INSTRUMENTATION 儀器儀表 NANOSCIENCE & NANOTECHNOLOGY 納米科技 PHYSICS, APPLIED 物理：應(yīng)用	4區(qū) 4區(qū) 4區(qū) 4區(qū)

中科院 2022年12月升級(jí)版

Top期刊	綜述期刊	大類學(xué)科		小類學(xué)科
否	否	工程技術(shù)	4區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 INSTRUMENTS & INSTRUMENTATION 儀器儀表 NANOSCIENCE & NANOTECHNOLOGY 納米科技 PHYSICS, APPLIED 物理：應(yīng)用	4區(qū) 4區(qū) 4區(qū) 4區(qū)

中科院 2021年12月舊的升級(jí)版

Top期刊	綜述期刊	大類學(xué)科		小類學(xué)科
否	否	工程技術(shù)	4區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 INSTRUMENTS & INSTRUMENTATION 儀器儀表 NANOSCIENCE & NANOTECHNOLOGY 納米科技 PHYSICS, APPLIED 物理：應(yīng)用	4區(qū) 4區(qū) 4區(qū) 4區(qū)

中科院 2021年12月基礎(chǔ)版

Top期刊	綜述期刊	大類學(xué)科		小類學(xué)科
否	否	工程技術(shù)	4區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 INSTRUMENTS & INSTRUMENTATION 儀器儀表 NANOSCIENCE & NANOTECHNOLOGY 納米科技 PHYSICS, APPLIED 物理：應(yīng)用	4區(qū) 4區(qū) 4區(qū) 4區(qū)

中科院 2021年12月升級(jí)版

Top期刊	綜述期刊	大類學(xué)科		小類學(xué)科
否	否	工程技術(shù)	4區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 INSTRUMENTS & INSTRUMENTATION 儀器儀表 NANOSCIENCE & NANOTECHNOLOGY 納米科技 PHYSICS, APPLIED 物理：應(yīng)用	4區(qū) 4區(qū) 4區(qū) 4區(qū)

中科院 2020年12月舊的升級(jí)版

Top期刊	綜述期刊	大類學(xué)科		小類學(xué)科
否	否	工程技術(shù)	4區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 INSTRUMENTS & INSTRUMENTATION 儀器儀表 NANOSCIENCE & NANOTECHNOLOGY 納米科技 PHYSICS, APPLIED 物理：應(yīng)用	4區(qū) 4區(qū) 4區(qū) 4區(qū)

Journal Of Micromechanics And Microengineering JCR評(píng)價(jià)數(shù)據(jù)（2023-2024年最新版）

按JIF指標(biāo)學(xué)科分區(qū)	收錄子集	分區(qū)	排名	百分位
學(xué)科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q2	170 / 352	51.8%
學(xué)科：INSTRUMENTS & INSTRUMENTATION	SCIE	Q2	29 / 76	62.5%
學(xué)科：NANOSCIENCE & NANOTECHNOLOGY	SCIE	Q3	102 / 140	27.5%
學(xué)科：PHYSICS, APPLIED	SCIE	Q3	96 / 179	46.6%

按JCI指標(biāo)學(xué)科分區(qū)	收錄子集	分區(qū)	排名	百分位
學(xué)科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q3	200 / 354	43.64%
學(xué)科：INSTRUMENTS & INSTRUMENTATION	SCIE	Q3	46 / 76	40.13%
學(xué)科：NANOSCIENCE & NANOTECHNOLOGY	SCIE	Q3	82 / 140	41.79%
學(xué)科：PHYSICS, APPLIED	SCIE	Q3	106 / 179	41.06%

Journal Of Micromechanics And Microengineering歷年數(shù)據(jù)統(tǒng)計(jì)

影響因子

中科院分區(qū)

Journal Of Micromechanics And Microengineering中國(guó)學(xué)者發(fā)文選摘

1、Loss mechanisms of multi-frequency whispering gallery mode RF-MEMS resonators
Author: Liu, Wenli; Chen, Zeji; Lu, Yujie; Zhao, Junyuan; Zhu, Yinfang; Yang, Jinling; Yang, Fuhua

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 1, pp. -. DOI: 10.1088/1361-6439/ac8bde
2、Remote actuation based on magnetically responsive pillar arrays
Author: Jiang, Wei; Wang, Lanlan; Chen, Bangdao; Liu, Hongzhong

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 1, pp. -. DOI: 10.1088/1361-6439/aca20f
3、Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors
Author: Zhang, Yunfan; Wu, Kangkang; Shen, Shengnan; Zhang, Quanyong; Cao, Wan; Liu, Sheng

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 2, pp. -. DOI: 10.1088/1361-6439/aca913
4、Topology optimization design of compliant amplification mechanisms with low parasitic displacement
Author: Wang, Qiliang; Wei, Jianming; Long, Yiping; Tan, Jianping

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 2, pp. -. DOI: 10.1088/1361-6439/aca4dc
5、An ionic pressure sensor array with digitizable sensitivity
Author: Zou, Qiang; Liu, Chenyu; Su, Qi; Xue, Tao

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acc873
6、Identification and suppression of driving force misalignment angle for a MEMS gyroscope using parametric excitation
Author: Zheng, Xudong; Wang, Xuetong; Shen, Yaojie; Xia, Chenhao; Tong, Wenyuan; Jin, Zhonghe; Ma, Zhipeng

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acbfc6
7、Research on high temperature performance of pressure sensor
Author: Zhao, Zhiqiang; Pan, Shuliang; Memon, Maria Muzamil; Liu, Qiong; Wang, Tao; Zhang, Wanli

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acc6dd
8、Developing a multi-sample acoustofluidic device for high-throughput cell aggregation
Author: Yang, Renhua; Huang, Siping; Zhang, Yiwen; Zhang, Chao; Qian, Jingui; Lam, Raymond H. W.; Lee, Joshua E-Y; Wang, Zuankai

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acbfc5